发明名称 Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung
摘要 <p>In a laser processing method and a laser processing apparatus for projecting a laser beam to a work so as to process this work, an irradiated shape of the laser beam is defined in such a manner that a desirable processing region of the work is irradiated by the laser beam, and also a power density distribution of the laser beam is defined in such a manner that power density suitable for processing each portion of the work is given to each portion of the work within the desirable processing region. <IMAGE></p>
申请公布号 DE69213281(T2) 申请公布日期 1997.02.06
申请号 DE1992613281T 申请日期 1992.03.18
申请人 HITACHI, LTD., TOKIO/TOKYO, JP 发明人 HONGO, MIKIO, TOTSUKA-KU, YOKOHAMA-SHI, JP;MIYAUCHI, TATEOKI, YOKOHAMA-SHI, JP;MARUYAMA, SHIGENOBU, YOKOHAMA-SHI, JP;SAKAMOTO, HARUHISA, YOKOHAMA-SHI, JP;MIZUKOSHI, KATSURO, YOKOHAMA-SHI, JP
分类号 B23K1/00;B23K26/03;B23K26/06;B23K26/073;G02F1/1343;H05K3/02;(IPC1-7):H05K3/00 主分类号 B23K1/00
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