| 摘要 |
PROBLEM TO BE SOLVED: To prevent a workpiece from being damaged and uniformly polish the whole surface to thereby improve the flatteness. SOLUTION: A surface of a wafer 24 is polished by the provision of a surface plate 56 on which surface a polishing face 60 for polishing the wafer 24 is formed, a pressing part for pressing the wafer 24 against the polishing face 60, and a moving mechanism for moving the wafer 24 pressed thereagainst and the surface plate. Furthermore, an injection port 36 for jetting out fluid towards the side of polishing face 60 from the surface of the pressing part so that the wafer 24 is pressed against the face 60 and supply means for fluid jetted out of the port 36. |
