发明名称 ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD FOR CONDUCTIVELY CONNECTING ELECTRONIC PARTS USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To prevent curing of an insulating adhesive even if accidentally heated before the use in an anisotropic conductive adhesive obtained by blending conductive particles in an insulating adhesive comprising a thermosetting resin. SOLUTION: This insulating adhesive 2 is composed of a thermoplastic resin (epoxy resin) blending a curing agent 4 coated with a covering film 5 in a main component (bisphenol A) 6. In usual states, the curing agent 4 coated with the covering film 5 can avoid contacting with the main component 6 and the covering film 5 can avoid to be destructed only by heating. Therefore, the insulating adhesive 2 can avoid to be cured even if accidentally heated before the use. On the other hand, when the adhesive is thermocompression bonded in the use, the curing agent 4 is contacted with the main component 6 by destroying the covering film 5 under the pressure, then the insulating adhesive 2 can be cured in the use.</p>
申请公布号 JPH0931427(A) 申请公布日期 1997.02.04
申请号 JP19950206781 申请日期 1995.07.21
申请人 CASIO COMPUT CO LTD 发明人 OKADA OSAMU
分类号 B01J13/04;C09J9/00;C09J11/04;H01R4/04;H05K3/32;H05K3/36;(IPC1-7):C09J9/00 主分类号 B01J13/04
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