发明名称 Interconnection structure of semiconductor device
摘要 An interconnection structure of a semiconductor device with a gate electrode, an active region provided in the vicinity of the gate electrode and a first buried layer in a contact hole exposing the gate electrode and the active region. The contact hole is easily formed, and the first buried layer has a substantially low interconnection resistance value.
申请公布号 US5600170(A) 申请公布日期 1997.02.04
申请号 US19950479735 申请日期 1995.06.07
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 SUGIYAMA, MASAO;AMISHIRO, HIROYUKI;HIGASHITANI, KEIICHI
分类号 H01L23/522;H01L21/768;H01L23/485;H01L29/417;H01L29/45;H01L29/49;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113 主分类号 H01L23/522
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