发明名称 Thin film transistor with particular nitrogen concentration
摘要 According to a method of manufacturing a thin film transistor (TFT), amorphous silicon is formed by ion-implanting either silicon or nitrogen into a region of polysilicon while a region located at the sidewall of a gate electrode is selectively left using the stepped portion of the gate electrode. Then, a heat treatment is applied to convert the amorphous silicon into polysilicon with the remaining polysilicon as a seed crystal. As a result, polysilicon having crystal grains of great grain size can be formed in uniform. Thus, the electric characteristics of a TFT can be improved with no difference in the electric characteristics between each TFT.
申请公布号 US5600154(A) 申请公布日期 1997.02.04
申请号 US19950546514 申请日期 1995.10.20
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 SHIMIZU, SATOSHI;UENO, SHUICHI;MAEDA, SHIGENOBU;IPPOSHI, TAKASHI
分类号 H01L21/20;H01L21/265;H01L21/336;H01L27/11;H01L29/78;H01L29/786;(IPC1-7):H01L29/76;H01L29/12;H01L27/108 主分类号 H01L21/20
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