| 摘要 |
In a support (100) for a wafer-shaped object, in particular a silicon wafer, there is a concentric nozzle (8) in the face (10) of the support (100) opposite the wafer-shaped object. On the face (10) opposite the object there is a ring (108). Within the ring (108) there is at least one aperture (107) from which a passage (110) extends to a vacuum producing device (111) housed inside the support (100). As a result of the prevailing vacuum within the ring (108), optionally supported by the vacuum existing outside the ring (108) in accordance with Bernoulli's principle, the object is held in contact with the ring (108) of the support (100) and prevented from moving in a direction parallel to the face (10), without requiring lateral supports such as projections or the like. Since lateral supports can be dispensed with, they will not hinder the flow of treatment fluid off the wafer-shaped object. |
