发明名称 |
Condensing device for sputtering device |
摘要 |
A condensing device for a sputtering device capable of condensing metal atoms to be ejected from a metal target onto a semiconductor substrate in a scattered manner and thereby easily depositing the metal atoms on side walls of contact holes formed at the semiconductor substrate is disclosed. The condensing device includes a plurality of condensing tubes arranged in the form of a bundle and adapted to condense the metal atoms ejected from the metal target, each of the condensing tubes being constituted by a set of condensing plates, and a plurality of inclination adjusting plates each interposed between adjacent ones of the condensing tubes and adapted to incline each of the adjacent condensing tubes at an angle ranging between 0 DEG to 15 DEG .
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申请公布号 |
US5597462(A) |
申请公布日期 |
1997.01.28 |
申请号 |
US19940265659 |
申请日期 |
1994.06.24 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. |
发明人 |
CHO, GYOUNG S. |
分类号 |
H01J37/34;(IPC1-7):C23C14/34 |
主分类号 |
H01J37/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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