发明名称 Packing tray of semiconductor devices and a method for manufacturing the same
摘要 A packing tray for protecting all kinds of semiconductor packages or chips in the form of a tray-type packing tray, a tube-type packing tray, a reel tape-type packing tray, and a waffle-type packing tray wherein the packing tray is made of paper, paper pulp, and wood, which does not cause pollution when recycling, burning, and disposal in the soil.
申请公布号 US5597074(A) 申请公布日期 1997.01.28
申请号 US19940365553 申请日期 1994.12.28
申请人 KO, SEUNG S. 发明人 KO, SEUNG S.
分类号 B65D85/86;H01L23/00;H05K13/00;(IPC1-7):B65D73/02 主分类号 B65D85/86
代理机构 代理人
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