摘要 |
A packing tray for protecting all kinds of semiconductor packages or chips in the form of a tray-type packing tray, a tube-type packing tray, a reel tape-type packing tray, and a waffle-type packing tray wherein the packing tray is made of paper, paper pulp, and wood, which does not cause pollution when recycling, burning, and disposal in the soil.
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