| 摘要 |
<p>The portable object of a moulded plastics material, such as a chip card, has a structured recess to take a micromodule assembly with a conductor pellet and an integrated semiconductor circuit. The recess contour has at least two sections with a draft angle of less than 10[deg] to the perpendicular at the support surface with the recess opening. Also claimed is a mfg. process using injection moulding for the support. Each cavity, matching the support dimensions, has at least one mould insert matching the pellet contours, with a draft angle forming a dovetail in a thickness at least equal to the pellet dimensions.</p> |
