发明名称 SYSTEM AND APPARATUS FOR REDUCING ARCING AND LOCALIZED HEATING DURING MICROWAVE PROCESSING
摘要 A system and apparatus for reducing arcing and localized heating as a result of applying microwave energy to a microelectronic substrate having electronic components thereon is provided. The system (10) comprises a microwave furnace (11), means (20) for securing a microelectronic substrate (23) within the chamber (12), and means (30, 30') for electrically interconnecting the microelectronic substrate (23) with a ground (14) connected to an interior wall of the microwave furnace. The apparatus comprises a holder (20) for securing a microelectronic substrate (23) during the application of microwave energy and for providing the necessary electrical connections (30) for grounding components and circuitry thereon. The holder (20) may comprise a heat sink (52) for protection against heat build-up and for maintaining a microelectronic substrate (23) in a substantially flat orientation during microwave processing.
申请公布号 WO9702726(A1) 申请公布日期 1997.01.23
申请号 WO1996US11043 申请日期 1996.06.27
申请人 LAMBDA TECHNOLOGIES, INC.;FATHI, ZAKARYAE;GARARD, RICHARD, S.;WEI, JIANGHUA 发明人 FATHI, ZAKARYAE;GARARD, RICHARD, S.;WEI, JIANGHUA
分类号 H05B6/80;H05K3/34;(IPC1-7):H05K3/30 主分类号 H05B6/80
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