METHOD AND DEVICE FOR CHEMICAL AND ELECTROLYTIC TREATMENT OF PRINTED CIRCUIT BOARDS AND CONDUCTOR FILMS

摘要

The invention pertains to a procedure for the rapid and high-precision chemical and electrolytic treatment and scouring of printed circuit boards and films, using a treatment fluid through which the printed circuit boards and films are conveyed in a horizontal position and direction. The invention also pertains to a device for carrying out this procedure. To speed up these processes, the surface of the articles undergoing treatment must be exposed to a macrostream delivering active treatment fluid. In addition, micro-exchange of material into the diffusion layer must be promoted. According to the invention this is achieved by using hydrodynamically acting cavitation generators which produce cavitation bubbles formed in liquid jets (50); this is done by forcing the treatment fluid out of the generator under high pressure and causing the treatment fluid in the generators to move in eddies. The treatment fluid is forced under high pressure in a circulation through cavitation bubble-generating nozzles (10) and discharged in large quantities onto the surface. The cavitation bubbles in the fluid implode at the diffusion layer and thus bring about the micro-exchange of material. The process is particularly effective in the treatment of fine-conductor printed circuit boards with fine bores and blind holes.