| 摘要 |
A submount comprising: an insulating substrate (1) having therein a throughhole filled with a sintered metal powder (3), and an electroconductive layer (2) formed on each of two opposing surfaces of the insulating substrate (1), and wherein the two electroconductive layers (2) are electrically connected with each other at least partially by the sintered metal powder (3). The sintered metal powder may be provided as a metal paste comprising powder, organic binder, organic solvent and a powdery additive. <IMAGE> |
