| 摘要 |
PURPOSE: To lower a baking temperature by making a composition comprising TiO2 and ZnO as main components and B2 O3 or a glass component containing B2 O3 . CONSTITUTION: TiO2 , ZnO and B2 O3 or a glass component containing B2 O3 and optionally SiO2 in the ratio of 40-90mol% of TiO3 , 60-10mol% of ZnO, 0.1-6wt.% calculated as B2 O3 based on TiO2 +ZnO of B2 O3 or the glass component containing B2 O3 and <=5wt.% of SiO2 are weighed and ground by a ball mill. Then the mixed powder is calcined in the atmosphere and optionally mixed with <=10wt.% of one or more of NiO, CuO and MnO and ground to prepare dielectric material powder. The dielectric material powder is blended with a binder such as ethyl cellulose, etc., a solvent such as terpineol, kneaded and dispersed to prepare a dielectric material paste. The dielectric material and an Ag or Cu paste are alternately laminated, cut in a fixed size, baked in the atmosphere and an external electrode such as Ag, etc., is baked and bonded to the cut laminate to give a laminated chip condenser. |
