| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a tray for a semiconductor chip for taking out the chip by sucking a surrounding thereof and improve quality of chips, by preventing damage to the surface of the chip. SOLUTION: A tray main body 21 has a rib 31 formed upright with a chickness smaller than a chip. The rib 31 is fitted to a surrounding part of the chip for limiting the movement of the chip. A tray 33 is constituted in a way that the tray main body 21 has a threshold part 29 projected at an upper part of the tray main body 21, and a recessed part 25 for storing the chip at the threshold part 29. Then, the recessed part 25 is fitted to the surrounding part of the chip to limit the movement of the chip, and the rib 31 with a thickness smaller than the chip is provided at the recessed part 25.</p> |
