Plastic packaged integrated circuit with heat spreader

摘要

A heat spreader with one or more integrally formed open regions discourages the formation of air bubbles in the encapsulant of a plastic packaged integrated circuit. Little or no air bubbles can be trapped between the heat spreader and the encapsulant surface. Any air bubbles that do form in the encapsulant can escape through the open regions of the heat spreader. The heat spreader of the invention is placed on the surface of a liquid encapsulant and the encapsulant fills the open regions of the heat spreader and covers the sides of the open regions. When the encapsulant hardens, a form fitting bond between the heat spreader and the upper surface of the encapsulant is created. This form fitting bond provides for secure attachment of the heat spreader to the surface of the encapsulant. One embodiment of the heat spreader of the invention includes integrally formed tabs with which a supplementary heat spreader, such as heat tower, is inserted for even greater heat dissipation capability.