CUTTING OF GARNET SINGLE CRYSTAL FILM

摘要

PROBLEM TO BE SOLVED: To provide a method for cutting a garnet single crystal film, capable of reducing the failure of the cutting due to chipping by forming a notch having specific length and depth on the film of bismuth-replaced rare earth element-iron garnet single crystal and subsequently perfectly cutting the film. SOLUTION: A notch having a length of >=30μm and a depth which is maximally 40% of the thickness of a bismuth-replaced rare earth element-iron single crystal (BIG) film is once formed with a dicing machine at the cutting position of the BIG film raised by a liquid phase epitaxial method and having a thickness of >=200μm. An adhesive tape whose adhesive force is largely eliminated by a means such as heating, light irradiation or electron bean irradiation is adhered to the film, and the notched film is perfectly cut into pieces having each a 3mm×3mm size or smaller with the dicing machine. The adhesive tape is subsequently removed. The moving speed of the blade is 0.3-2mm/sec in the notching and cutting processes.