发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which can effectively prevent the cracking of its insulating substrate that may cause the stripping off, disconnection, etc., of wiring conductors and is formed by firmly sticking the wiring conductors to the insulating substrate in a prescribed pattern. SOLUTION: A wiring board is constituted by integrally forming wiring conductors 2 in and on an insulating substrate 1 composed of a sintered ceramic body. The corner sections (c) of the wiring conductors 2 formed in the insulating substrate 1 are rounded to circular-arcuate shapes.
申请公布号 JPH0923044(A) 申请公布日期 1997.01.21
申请号 JP19950168792 申请日期 1995.07.04
申请人 KYOCERA CORP 发明人 NAKAGAWA SHOICHI;TERAO SHINYA;FUKUDA JUN;AIHARA KENICHI;OKUNOSONO TAKASHI
分类号 H05K1/02;H05K1/03;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/02
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