| 摘要 |
PURPOSE: To provide a low-cost package for semiconductor realizing correspondence to reduction in size of the package or number of high input and output signal and improving the transmission characteristics of a high-frequency signal. CONSTITUTION: A surface interconnection layer 4 having a simultaneously baked conductor layer 7 made of tungsten formed by the simultaneously baking with an aluminum nitride multilayer board 2 and a low resistance conductor film 8 made of a thick gold-plated film formed on the surface is formed as signal wirings on the element mounting surface 2a of an aluminum nitride multilayer board 2 mounted with a semiconductor element. The one side end of the layer 4 for forming signal interconnection is used as an electrode pad 5 for boding, and an external terminal made of solder bump 6 is connected to the other end. Further, a solid surface-like inner interconnection layer 9 to become at least a power source layer and a ground layer is provided in the board 2. |
