| 摘要 |
PURPOSE: To polish a semiconductor wafer so as not to generate a sagging corner at its peripheral part by a method wherein, when the surface of the semiconductor wafer is polished to bring a rigid pad into sliding contact, the surface of the semiconductor wafer and the surface of a holding ring constitute a nearly identical face. CONSTITUTION: A recessed part 12 is formed on the rear surface of a polishing surface plate 11, and a flexible back pad 13 is inserted into the recessed part 12, and a semiconductor wafer 14 is brought into close contact with the back pad 13. Then, a ring-shaped holding ring 15 is fixed and bonded to the rear surface of the polishing surface plate 11 by using a pressure-sensitive double- coated adhesive tape so as to surround the semiconductor wafer 14. At this time, the surface of the semiconductor wafer 14 is situated to protrude from the surface of the holding ring 15 by a prescribed height. In this manner, a rigid pad 16 and the polishing surface plate 11 are turned, the rigid pad 16 is pressed to the surface of the semiconductor wafer 14 so as to sink the surface of the holding ring 15 and the surface of the semiconductor wafer 14 constitutes a nearly identical horizontal plane, and a polishing operation is performed. |
