| 摘要 |
<p>PURPOSE: To obtain a wafer dicing apparatus in which scraps of adhesive on a dicing tape can be removed easily by cleaning water even when the scraps are stuck to the wafer being diced. CONSTITUTION: A wafer dicing apparatus 1A is constituted in such a way that a dicing tape T on which an adhesive layer A is formed is pasted on one face of the wafer S on which an LCD element, a CCD element, an IC element or the like are formed, that the wafer S is cut completely into a plurality of pieces by a rotary blade 3 from the other face on which the dicing tape T is not pasted and that the wafer S is cut by the rotary blade 3 while the adhesive force of an adhesive on the adhesive layer A on a dicing line used to cut the wafer S is being lowered in advance by irradiation with ultraviolet rays UV or heat rays.</p> |
