| 摘要 |
PURPOSE: To raise connection strength between a wire and a bonding pad and simplify a manufacturing process by providing a bonding pad, fixing a metal block to a heat sink by conductive adhesive and connecting an input/output terminal of a semiconductor chip to a bonding pad by a wire. CONSTITUTION: This device is comprised of a circuit board 1, a bonding pad 17, a heat sink 2, a metal block 3 and a semiconductor chip 4; it is provided with the bonding pad 17 unlike a conventional constitution. The bonding pad 17 is electrically connected to a circuit pattern 6 by using conductive adhesive 13, the metal block 3 is fixed to the heat sink 2 by the conductive adhesive 13 and an input/output terminal of the semiconductor chip 4 is connected to the bonding pad 17 by a wire. A surface is thereby always kept clean and connection strength of a wire and the bonding pad 17 can be ensured enough. Furthermore, a manufacturing process is made simple. |
