发明名称 |
Gerät zum automatischen Läppen von Wafern |
摘要 |
An automatic wafer (W) lapping apparatus (1) including: a lapping assembly (A) consisting of an upper lapping plate, a lower lapping plate and wafer carriers (7); a loader assembly (B) installed in the vicinity of the lapping assembly; an unloader assembly (C) installed in the vicinity of the lapping assembly; and a robot (D) having wafer holder member (26) for holding a plurality of wafers (W) and for transferring the wafers between the loader assembly and the unloader assembly and the lapping assembly, WHEREIN the wafer lapping assembly further includes a position sensor (9) for detecting the position of the carriers (7) and a device (33) for cleaning the wafer holder, and the robot (D) consists of a single-handed arm (25) and the wafer holder (26) supported at the fore end of the arm of the robot which can hold wafers (W) one by one. <IMAGE> |
申请公布号 |
DE69210566(T2) |
申请公布日期 |
1997.01.16 |
申请号 |
DE1992610566T |
申请日期 |
1992.12.17 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD., TOKIO/TOKYO, JP |
发明人 |
HASHIMOTO, HIROMASA, NISHI-SHIRAKAWA-GUN, FUKUSHIMA-KEN, JP |
分类号 |
B24B37/04;B24B47/22;H01L21/304;H01L21/677 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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