Etching recipe for the CrSi film

摘要

An etchant recipe suitable for the photo-etching process of the CrSi metalized film in the patterning of electronic circuitry. The etchant comprises 100 to 120 parts of 36.5 to 38% HCl, 1.0 to 2.0 parts of 48.8 to 49.2% HF, 0 to 10 parts of 30.0 to 32.0% H2O2 and 50 to 100 parts of 85 to 87% H3PO4. A 0.1 g/100 cc wetting agent is optionally added.