SEMICONDUCTOR WAFER GRINDING METHOD AND APPARATUS,申请号JP19950172682-传众专利搜索

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发明名称	SEMICONDUCTOR WAFER GRINDING METHOD AND APPARATUS
摘要
申请公布号	JPH097986(A)	申请公布日期	1997.01.10
申请号	JP19950172682	申请日期	1995.06.14
申请人	MITSUBISHI MATERIALS SHILICON CORP;MITSUBISHI MATERIALS CORP	发明人	TANAKA KEIICHI;KAGAYA OSAMU;HATANAKA TORU
分类号	H01L21/304;(IPC1-7):H01L21/304	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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