| 摘要 |
PROBLEM TO BE SOLVED: To evade a problem of solder remains, by forming a two-layered dam structure body composed of an upper sacrificial layer and a lower permanent layer, on each pad, forming a solder bump on a defined pad part, and eliminating the upper sacrificial layer of the dam structure body. SOLUTION: A remain eliminating process is constituted by eliminating the upper layer part 24 of a two-layered dam surface. The upper dam layer 24 is etched by applying vibration to solution, and a lower part dam layer 22 is not etched but left. The lower part layer 22 of the first two-layered dam structure is left. When a solder bump is heated in the later process, and electrically and mechanically connected with a bonding pad of an element, the flow of fused solder to the whole region of an adjacent metal pattern is effectively blocked by the layer 22. |
