| 摘要 |
PURPOSE: To provide a method of manufacturing a multilayer wiring board, which inhibits the main cause of the failure of a thin film wiring due to various defect parts in the surface of a ceramic board. CONSTITUTION: An inorganic alumina boehmits film 5 is filled in a lower layer on the polished surface of a board 1 and an organic polyimide film 6 is filled in an upper layer on the lower layer for a hole-filing of defect parts, such as a void 3 and a gap 4, existing in the polished surface of the board 1, the films 5 and 6 are fired, a film formation is conducted and the respective filled films are individually polished on a polishing treatment condition obtainable a selectively, whereby an even and smoothed surface, which has no irregularities, is formed on the board 1 and a highly reliable thin film patterned circuit 7 is formed on its smoothed surface of the board. |
