| 摘要 |
<p>PURPOSE: To obtain a shelf formation method in which a prinetd-circuit board with a multistage bonding shelf can be manufactured easily, in which a printed- wiring board used to mount a semiconductor chip or the like can be manufactured with high accuracy and at low costs and in which a printed-circuit board, for a pin-grid array, with a bonding shelf and a printed-circuit board for a ball-grid array can be manufactured with high accuracy and at low costs by making use of it. CONSTITUTION: In a shelf formation method for bonding of a multilayer printed- circuit board, a bonding terminal 15 is formed in advance in a multilayer printed-circuit board which has formed a circuit 7 at the inside, a resin layer 8 which is situated at the upper part of the terminal 15 in an inner layer 2 is then removed, an opening is formed, and a bonding shelf 12 in which the terminal 15 is exposed is formed.</p> |
