发明名称 HOUSING CONTAINER
摘要 <p>PURPOSE: To provide a housing container wherein a received QFP.IC can be prevented from shifting in position. CONSTITUTION: A housing container 10 has a body 11 formed in a flat plate shape, a recess 12 recessed on an upper face of the body 11, a support 13 protruding upward on a bottom of the recess 12 for receiving a resin-molding 2 part of a QFP.IC 1 mounted, and four positioning parts 14 protruding upward on the bottom of the recess 12 located close to four corners of the support 13. An upper end of the positioning part 14 is at the approximately same height with the upper face of the body 11, a pair of inner faces 15 of the positioning part 14 are located close to a side of the corner of the support 13, and a pair of vertical outer faces 16 perpendicular to the pair of inner faces 15 are located close to an outer lead 3 at an end of outer leads 3 provided on a side of the resin-molding 2 while the QFP.IC 1 is mounted on the support 13.</p>
申请公布号 JPH092567(A) 申请公布日期 1997.01.07
申请号 JP19950193998 申请日期 1995.06.14
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 SHIBUYA AKIO
分类号 B65D85/86;H01L21/673;H01L21/68;(IPC1-7):B65D85/86 主分类号 B65D85/86
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