发明名称 DEVICE AND METHOD FOR SEALING RESIN SHEET
摘要 PURPOSE: To greatly reduce the cost on a mass-production line and to ensure a stabilized, proper sealing of a part to be sealed when it has a complicated shape by employing a ceramic material with the thermal conductivity, compressive strength, and bending strength all at respective specific values for the constitution of a support of heating elements. CONSTITUTION: The subject relates to a sealing device 1 for resin sheets which effects under heat a sealing between resin sheets 2, 3 by pressing heating elements 8, 9 on the resin sheets 2, 3 or between a resin sheet 2 or 3 and a resin-made outlet port 4. Supports 6, 10 for supporting heating elements 8, 9 are formed of a ceramic material which has a thermal conductivity of 0.01cal/cm.sec. deg.C or more, compressive strength of 1,000kg/cm<2> or more, and bending strength of 300kg/cm<2> or more and is capable of machining. The heating elements 8, 9, placed on the outer side of the supports 6, 7, are ones which are heated by high-frequency induction heating. As a result, the heating elements 8, 9 are heated uniformly at the sealing part and, even when the part to be sealed has a complicated shape, sealing can be provided properly without forming a pinhole.
申请公布号 JPH092427(A) 申请公布日期 1997.01.07
申请号 JP19950174373 申请日期 1995.06.16
申请人 MATERIAL ENG TECH LAB INC 发明人 ISONO KEINOSUKE;YOSHIDA TAKAO
分类号 B65B51/10;A61J1/10;B29C35/16;B29C65/18;B29C65/32;B29L22/00;C04B35/581;C04B35/583;C04B35/584 主分类号 B65B51/10
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