| 摘要 |
<p>The present invention provides an ink composition which comprises a blend of 100 parts by weight of a copolymer comprising a polycaprolactonepolyol, a diamine and a diisocyanate, 30 to 300 parts by weight of a novolac type epoxy resin, 30 to 300 parts by weight of a bisphenol type epoxy resin, 0.2 to 20 parts by weight of a thixotropic agent, 0.1 to 30 parts by weight of a defoaming agent, and 0.1 to 10 parts by weight of a leveling agent. This ink composition is excellent in storage stability, heat resistance, adhesive properties, flexibility, electrical properties, chemical resistance and printing properties as a one-pack type ink composition. It can be used for covering circuit boards.</p> |
