发明名称 Adhesive system for wrap-around labels for metal, glass, plastics etc containers
摘要 An adhesive system for wrap-round labels includes a carrier (or contact) adhesive and an overlap adhesive, the carrier adhesive being completely soluble in an aq medium at pH 8-14 and being a hot melt adhesive which shows a markedly higher adhesiveness at its application temp of 90-160 deg C than at its storage temp. Application of the wrap-round label contg weakened strips to a substrate (pref a hollow body) using the adhesive system is by (a) applying the carrier adhesive to (part of) the substrate body or to the reverse side of the label at 90-150 deg C; (b) placing the label around the substrate body and bonding the reverse side of one end with the front of the other end; and (c) allowing the label to cool.
申请公布号 DE19522568(A1) 申请公布日期 1997.01.02
申请号 DE19951022568 申请日期 1995.06.26
申请人 HENKEL KGAA, 40589 DUESSELDORF, DE 发明人 HEEMANN, MARCUS, 40225 DUESSELDORF, DE;KLINGBERG, WOLFGANG, 41352 KORSCHENBROICH, DE;PUERKNER, ECKHARD, DR., 40595 DUESSELDORF, DE;HERLFTERKAMP, BERNHARD, 46236 BOTTROP, DE
分类号 B65C9/20;C09J7/02;C09J7/04;C09J167/00;(IPC1-7):C09J167/00;C09J133/02;C09J5/06 主分类号 B65C9/20
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