| 发明名称 |
Method for making semiconductor devices having electroplated leads |
| 摘要 |
A semiconductor device which includes an encapsulated portion(51) and has several exposed leads(49) is electroplated with a solderable meta(53). The electroplated leads are heated to a temperature sufficient to cause melting and flowing prior to attaching the semiconductor device in the next level of assembly. |
| 申请公布号 |
EP0751555(A2) |
申请公布日期 |
1997.01.02 |
| 申请号 |
EP19960109698 |
申请日期 |
1996.06.17 |
| 申请人 |
MOTOROLA, INC. |
发明人 |
KNAPP, JAMES H.;CARNEY, FRANCIS J., JR. |
| 分类号 |
H01L23/50;H01L21/48;(IPC1-7):H01L21/48 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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