Sawing or cutting procedure using wire for fine slices or precision devices e.g. for solar cell

摘要

The cutting method involves using a device comprising a sheet of wires (3) which can be displaced by a continuous or alternating motion. The method involves placing a piece to be cut (2) on a support table (4). The wire is supported by guide wire cylinders (1). The cutting process comprises the superposition of two movements, the first (5) defining the speed of the cutting and the other alternating (6,7) and of a small step or amplitude designed to form simultaneously a texture or mark (8) on the cut slices or pieces. The alternating movement occurs by a perpendicular displacement of the table, and is created by an axial movement of the wire.