| 摘要 |
A semiconductor die carrier includes an insulative package; a plurality of conductive leads extending from the insulative package; a die attach plate housed within the insulative package, the die attach plate comprising a first surface located on one side of the die attach plate and a second surface located opposite the first surface on an opposing side of the die attach plate; at least one semiconductor die secured to the first surface of the die attach plate; and at least one semiconductor die secured to the second surface of the die attach plate. |
