| 摘要 |
<p>PURPOSE: To evenly switch a main current path and a control current path by reducing the inductances of the current paths and, even when semiconductor chips are connected in parallel with each other, making the inductance of each current path nearly equal to each other. CONSTITUTION: In a semiconductor device for electric power, the first and second main current electrodes and control signal electrodes of one or more semiconductor chips are electrically connected to corresponding first, second, and third electrode pads. The first and third electrode pads 4 and 5 are fixed to a first electric insulating plate 1 at a distance to each other and a semiconductor element 7 is mounted on the first electrode pad 4 and the first main current electrode is connected to the element 7 and, at the same time, a second electric insulating plate 6 is fixed to the pad 4. In addition, the second electrode pad 9 is fixed to the second insulating plate 6. Conductive terminals are respectively extended from the first, second, and third electrode pads 4, 9, and 5.</p> |
