| 摘要 |
<p>PURPOSE: To provide a lead frame for semiconductor device having such easiness in assembling that, when a semiconductor device is mounted on a printed board by inserting pins into the printed board, the outer leads of the device can be smoothly inserted into the part holes of the board only if the outer leads are machined secondarily. CONSTITUTION: In a lead frame 1 for semiconductor device formed by patterning metallic ribbons into die pads 1a, outer leads 1b, and dam bars 1c, the leads 1b are formed narrower as going to their front ends. In the case of mounting a semiconductor device on a printed board inserting pins into the board, the device is mounted on the board by inserting the cut front ends of the leads 1b into parts holes 5a of the board after the leads 1b are cut in linear cut ends at desired lengths.</p> |
