| 摘要 |
PURPOSE: To decrease the number of stages in production by simultaneously executing the simplification of formation of a processing monitor section and the removal of a conductor coil substrate layer previously formed for the purpose of a conductive coil layer. CONSTITUTION: The gap formation of element parts is executed in a stage (a) in this process for producing thin-film magnetic head. A lower magnetic layer 22 is formed on a substrate 20 and a gap film 24 is formed thereon by a sputtered film of alumina, etc. Next, a first insulating layer 30 is disposed by a hard baked film formed by subjecting a resist to a thermal curing treatment in a stage (b). The conductor substrate layer 32 is disposed and is energized to plate the conductor coil layer 34 in a stage (c). The conductor substrate layer 32 is, for example, a Ti-Cu film, and the conductor coil is, for example, a Cu film formed in a spirally wound state. Next, a Ti film 26 is deposited by evaporation at a film thickness of about 1400Åin a stage (d) and the resist 28 is patterned in a stage (e). The unnecessary parts are removed by ion milling in a stage (f) and simultaneously, the Ti film 26 and the conductor substrate layer 32 are removed. The resist 28 is removed as well. A second insulating layer 36 is disposed and apexes are formed and thereafter, the excess Ti film is removed in a stage (g).
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