<p>A bonding head 18 for an automatic wire bonding machine, comprises a flame-off electrode 2 which is adapted to be lifted away from an operative position in which it is used to form a ball 36 on the end of the bonding wire 38 and a capillary 34 through which the bonding wire 38 is supplied to the flame-off electrode 2. The capillary 34 is also adapted to apply pressure and ultrasonic energy to the wire 38 when it is in contact with the surface to which it is to be bonded. The flame-off electrode 2 is adapted to be lifted away from the operative position by movement of the bond head 18 from a flame-off position to a bonding position. <IMAGE></p>
申请公布号
DE69119574(T2)
申请公布日期
1996.12.19
申请号
DE1991619574T
申请日期
1991.12.06
申请人
F & K DELVOTEC BONDTECHNIK GMBH, 82041 OBERHACHING, DE