| 摘要 |
<p>PURPOSE: To allow external lead terminals to be electrically connected with the specified external electric circuits accurately and rigidly by arranging multiple metalized wiring layers and connection pads joined to the upper side of an insulation base in a manner that they fan out from the central part toward its periphery. CONSTITUTION: Metalized wiring layers 4 and connection pads 5, which are joined to a ceramic green sheet as an insulation base 1 onto which a metallic paste obtained by adding a high melting-point metallic powder with an appropriate organic solvent is joined in advance, are joined onto an insulation base 1 and formed in such a manner that they fan out from the central part thereof toward its periphery. In this case, the metallic paste is printed and applied by a specified pattern and it is burned thereafter, then, when the square insulation base 1 having the layers 4 and the pads 5 is manufactured on the upper surface thereof, the pads 5 are hardly displaced even if a raw ceramic body is contracted. Therefore, the respective electrodes of a semiconductor device 3 can be accurately and electrically connected with the external electric circuits by means of external lead terminals 2.</p> |
