发明名称 |
Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together |
摘要 |
A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
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申请公布号 |
US5586006(A) |
申请公布日期 |
1996.12.17 |
申请号 |
US19950573577 |
申请日期 |
1995.12.15 |
申请人 |
FUJITSU LIMITED |
发明人 |
SEYAMA, KIYOTAKA;KIKUCHI, SHUNICHI;SUMIYOSHI, MAKOTO;YASUDA, NAOKI;HIRANO, MINORU;NORI, HITOSHI |
分类号 |
H01L25/18;H01L21/60;H01L23/12;H01L23/498;H01L25/04;H01L25/065;H05K1/14;H05K3/34;H05K3/36;H05K3/46;(IPC1-7):H05K7/20 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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