Laser machining apparatus and method

摘要

In a laser machining apparatus and method according to the present invention, a chip conveyor provided under the machining head parallel to the moving direction of the machining head recovers chips dropping near a movable area of a machining head, the chip tray provided in a section where the chip conveyor does not exit, receives chips dropping in a movable area of the machining table where the chip conveyor does not exist, and brushes provided under the machining table move along with the machining table to clean off chips stored in the chip trays and drop the chips onto the chip conveyor.