发明名称 Method for fabricating a semiconductor device
摘要 A method for fabricating a semiconductor device includes the steps of growing a second semiconductor layer on a first semiconductor layer which is highly doped with an impurity such as Zn and diffusing the impurity concurrently with the growing step of the second semiconductor layer from the first semiconductor layer as an impurity source to the second semiconductor layer to have a predetermined carrier concentration profile, by controlling both the diffusing speed of said impurity and the growing speed of said second semiconductor layer by changing the temperature in accordance with a predetermined sequence to have a predetermined carrier concentration profile in the second semiconductor layer.
申请公布号 US5585305(A) 申请公布日期 1996.12.17
申请号 US19940249197 申请日期 1994.05.26
申请人 SHIN-ETSU HANDOTAI CO. LTD. 发明人 YAMADA, MASATO;TAKENAKA, TAKAO
分类号 H01L21/22;H01L21/223;H01L33/00;H01L33/30;(IPC1-7):H01L33/00 主分类号 H01L21/22
代理机构 代理人
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