| 摘要 |
A circuit board consisting of an insulating substrate, a die bonding pad for fixedly bonding a semiconductor element onto the insulating substrate, and a wiring layer, in such a manner that the die bonding pad and wire layer are formed on the insulating substrate. A first heat conducting/radiating layer formed on the portion of the surface of the insulating substrate where the wiring layer and the die bonding pad are not formed, in such a manner that the first heat conducting/radiating layer is thermally connected to the die bonding pad. A second heat conducting/radiating layer is formed on the rear surface of the insulating substrate, and a heat bridge through which the die bonding pad or the first heat conducting/radiating layer is connected to the second heat conducting/radiating layer. The circuit board is light and small, and high in heat radiating characteristic, and low in manufacturing cost.
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