COPPER CLAD RESIN COMPOSITE MATERIAL

摘要

PURPOSE: To provide a copper clad resin composite material holding high radiation characteristics or electric characteristics accompanied by the miniaturization and high-degree integration of electronic machinery by coating copper foil with an epoxy resin having a specific compsn. to which dicyandiamide, a curing accelerator and inorg. fine particles are added. CONSTITUTION: An epoxy resin compsn. consisting of a resin compsn. (B) prepared by adding 1.0-4.0 pts.wt. of dicyandiamide and 10-95mol% with respect to dicyandiamide of a curing accelerator having potentiality at the nomal temp. to 100 pts.wt. of an epoxy resin (A) consisting of 50 pts.wt. or less of a polyfunctional resin, a brominated epoxy resin of which the bromine content is 25% or less by wt. of the total epoxy resin content and a bisphenol A type difunctional epoxy resin and inorg. fine particles (C) with an average particle size of 2-20μm and containing the inorg. fine particles (C) in an amt. of 60-80% by wt. of the whole is directly applied to copper foil in a thickness of 20-200μm.