| 摘要 |
High performance semiconductor devices, such as those used to package microprocessor integrated circuits, demand materials with excellent electrical, physical and chemical properties. Polymethylpentene (PMP) compositions provide resin substrates for high performance devices with a material which has a low dielectric constant and a low dissipation factor. In addition, PMP has very low moisture absorption, and good mechanical stability under repeated thermal stress, which will help keep the device from cracking and warping during high temperature assembly processes and constant use.
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