| 摘要 |
PURPOSE: To obtain an interlaminar insulating coating film having excellent adhesivity to a circuit-constituting copper plating and exhibiting excellent flame- retarding effect in a multi-layer printed circuit board manufactured by build-up method. CONSTITUTION: This electrically insulating material contains (A) an acid-pendant rubber-modified brominated epoxyvinyl ester resin having a structure obtained by reacting tetrahydromaleic anhydride with the hydroxyl group of a rubber- modified brominated epoxyvinyl ester resin produced by reacting acrylic acid with a brominated bisphenol A epoxy resin and a polymer having carboxyl groups at both molecular terminals and consisting of a straight-chain copolymer of a conjugated diene vinyl monomer and acrylonitrile, (B) a diluent, (C) a photopolymerization initiator and (D) a cresol novolak epoxy resin. |
