| 摘要 |
<p>A heat-resistant releasable film comprising (a) a layer (A) which is formed so as to cover the base to be coated and whose film forming component comprises 20 to 95 wt.% of frit and 5 to 80 wt.% of at least one heat-resistant resin selected from the group consisting of fluororesins, silicon resins, aromatic polysulfone resins, polyphenylene sulfide resins, polyimide-imide resins, and polyimide resins, and (b) a layer (B) which is formed so as to cover the surface of the layer (A) and whose film forming component comprises 20 to 100 wt.% of a fluororesin, 0 to 20 wt.% of frit and 0 to 80 wt.% of at least one heat-resistant resin selected from the group consisting of silicon resins, aromatic polysulfone resins, polyphenylene sulfide resins, polyamide-imide resins and polyimide resins.</p> |
