| 摘要 |
PURPOSE: To improve the freedom of layout of a bonding pad, a circuit, etc., in a semiconductor chip. CONSTITUTION: A part of the middle of a lead 3AL of a multilayered lead frame is transformed to a curved shape. Wire connecting regions 3AW for connecting the leads 3AL and wiring layers 3B as the lower layers of the leads 3AL by using bonding wires 5b are arranged between the leads 3AL which are adjacent to each other. |
