| 发明名称 |
Verfahren zum Verdrahten eines Laserarrays |
| 摘要 |
The invention applies to a row of semiconductor lasers. To dissipate the heat generated during operation, this row of lasers is wired by a thick metal tape (11) brazed (points 12) to the mesas (9) which surround the laser cavities (2). The other electrical polarity is applied by the support plate (3) through the substrate (1). |
| 申请公布号 |
DE69211828(T2) |
申请公布日期 |
1996.11.28 |
| 申请号 |
DE1992611828T |
申请日期 |
1992.12.14 |
| 申请人 |
THOMSON-CSF MICROELECTRONIQUE, PARIS, FR |
发明人 |
ROUSTIN, PASCAL, F-92402 COURBEVOIE CEDEX, FR |
| 分类号 |
H01S5/00;H01L21/603;H01S5/02;H01S5/042;H01S5/40;(IPC1-7):H01L21/603;H01S3/025;H01S3/25 |
主分类号 |
H01S5/00 |
| 代理机构 |
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