发明名称 Method of joining together a pair of members each having a high thermal conductivity
摘要 <p>A method of joining together a pair of members each having a high thermal conductivity comprises: forming a joining surface of a first of these two members with either of a plurality of projecting portions and a plurality of projecting and recessed portions; forming a joining surface of a second of the said extruded members with either a plurality of recessed portions each of which corresponds to a selected one of the said projecting portions and a plurality of projecting portions each of which corresponds to a selected one of the recessed portions of the said projecting and recessed portions of the said first member; and inserting under pressure each of the said projecting portions of one of the said two extruded members into each of said recessed portions that corresponds thereto, of another of the said two extruded members, with a tolerance that is sufficient to induce a plastic deformation in each of the said members. Two such members are preferably constituted each by an extruded materials and may constitute a pair of base plates or a pair of fin means and a base plate for a heat sink assembly. <IMAGE></p>
申请公布号 EP0744241(A2) 申请公布日期 1996.11.27
申请号 EP19960301406 申请日期 1996.03.01
申请人 TOUSUI, LTD. 发明人 TERADA, ATSUSHI
分类号 B21K25/00;B23P11/00;H01L21/48;H01L23/367;(IPC1-7):B23P11/00 主分类号 B21K25/00
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